- Silicon Engineering
- Embedded Solutions
- Software Solutions
- Insights
- Company
- Packaging & Test
End-to-end ASIC, SoC & FPGA design — specification to GDSII.
Advanced nodes down to 3nm.
RTL Design
Microarchitecture, coding, lint, CDC, synthesis-ready
Verification
UVM, formal, CDC/RDC, GLS, 99%+ coverage
Physical Design
Synthesis to GDSII — PnR, CTS, STA, IR/EM, PV
DFT
Scan, ATPG, BIST, JTAG, production test
Analog / AMS
PLL, ADC, DAC, LDO, SerDes, custom layout
SoC Integration
Architecture, interconnect, memory, UPF/CPF
DC · ICC2 · VCS · PT · StarRC
Genus · Innovus · Xcelium · Tempus · Virtuoso
Calibre · Tessent · Questa
40-60% Cost Savings
200K+ ECE Grads/Year
Follow-the-Sun
$10B+ Govt Investment
From concept to GDSII — let’s discuss your requirements.