Let's Talk

Manufacturing, Packaging & Test

From wafer to qualified device, Avecas supports the full back-end (OSAT/ATMP) flow — assembly and advanced packaging, wafer and final test, burn-in, system-level test, and reliability qualification — bridging chip design and high-yield, manufacturable silicon.

Assembly & Packaging

Assembly & Advanced Packaging

Wire bond and flip-chip assembly, wafer-level packaging (WLCSP), and advanced 2.5D/3D IC, Fan-Out (FOWLP), System-in-Package (SiP), Package-on-Package (PoP) and chiplet integration.

Wafer Bumping & Interconnect

Solder/copper-pillar bumping, redistribution layer (RDL) and high-density interconnect routing for advanced flip-chip and wafer-level devices.

Test Services

Wafer Test (Probe / Sort)

Wafer-level probe and sort to screen die before assembly, maximizing Known-Good-Die yield and reducing downstream packaging cost.

Final / Production Test

Package-level final test, device characterization and silicon bring-up support to ramp designs into high-volume, manufacturable silicon.

Learn more →

Burn-in & Reliability Qualification

Burn-in, HTOL and reliability qualification with Known-Good-Die strategies to ensure devices meet automotive-grade quality and lifetime targets.

System-Level Test (SLT)

Mission-mode, system-level test of packaged and integrated devices to catch defects that structural test misses, critical for AI, HPC and automotive parts.

Test Engineering, DFT & Automation

Design-for-Test (scan, BIST, boundary scan), ATE program development and test-flow automation for faster, repeatable, lower-cost validation.

Learn more →

Post-Silicon & Bring-Up

Post-Silicon Validation

Functional, performance, and compliance validation of first-pass silicon. Coverage includes corner testing, speed binning, thermal margins, and protocol compliance across PCI-e, USB, DDR, and high-speed SerDes interfaces.

Silicon Bring-Up & Debug

Hands-on board bring-up, power sequencing, clock bring-up, and silicon debug using oscilloscopes, logic analyzers, JTAG, and simulation correlation to isolate RTL, firmware, and board-level issues fast.

ATE & Test Program Development

ATE Programming & Development

ATE platform engineering on Teradyne (UltraFLEX, J750), Advantest (V93000), and Cohu/Xcerra systems. Full test cell bring-up, loadboard design support, and tester correlation across sites.

Test Program Development (TPD)

End-to-end test program development for wafer sort and final test: DC parametric, functional pattern porting (STIL/WGL), mixed-signal, RF, and power test flows with full test coverage documentation.

Failure Analysis & Yield

Failure Analysis (FA)

Systematic FA using optical inspection, SEM/EDX, FIB, EMMI, and thermal imaging to isolate electrical, process, and ESD failures. Root-cause reports aligned to product and process improvement actions.

Yield Engineering

Wafer map analysis, yield excursion investigation, CPK/SPC monitoring, and systematic defect isolation to drive yield ramp. Covers wafer sort yield, package yield, and final test yield improvement across HVM lines.

Need post-silicon, ATE or yield support for your product?

Talk to our team