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Manufacturing, Packaging & Test

From wafer to qualified device, Avecas supports the full back-end (OSAT/ATMP) flow — assembly and advanced packaging, wafer and final test, burn-in, system-level test, and reliability qualification — bridging chip design and high-yield, manufacturable silicon.

Assembly & Packaging

Assembly & Advanced Packaging

Wire bond and flip-chip assembly, wafer-level packaging (WLCSP), and advanced 2.5D/3D IC, Fan-Out (FOWLP), System-in-Package (SiP), Package-on-Package (PoP) and chiplet integration.

Wafer Bumping & Interconnect

Solder/copper-pillar bumping, redistribution layer (RDL) and high-density interconnect routing for advanced flip-chip and wafer-level devices.

Test Services

Wafer Test (Probe / Sort)

Wafer-level probe and sort to screen die before assembly, maximizing Known-Good-Die yield and reducing downstream packaging cost.

Final / Production Test

Package-level final test, device characterization and silicon bring-up support to ramp designs into high-volume, manufacturable silicon.

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Burn-in & Reliability Qualification

Burn-in, HTOL and reliability qualification with Known-Good-Die strategies to ensure devices meet automotive-grade quality and lifetime targets.

System-Level Test (SLT)

Mission-mode, system-level test of packaged and integrated devices to catch defects that structural test misses, critical for AI, HPC and automotive parts.

Test Engineering, DFT & Automation

Design-for-Test (scan, BIST, boundary scan), ATE program development and test-flow automation for faster, repeatable, lower-cost validation.

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Need assembly, packaging or test support for your product?

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