System-on-Chip (SoC) designs are becoming increasingly complex, combining multiple IP blocks, subsystems, and interfaces into a single, high-performance chip. The challenge lies not just in designing each subsystem, but in seamlessly integrating them into a tape-out ready SoC while meeting power, performance, and area (PPA) targets.

          At Avecas, we specialize in Subsystem & SoC Integration services that bridge the gap between individual IPs and a fully validated SoC. Our expertise ensures that every component interacts flawlessly, reducing risks, accelerating time-to-market, and enabling first-time-right silicon success.

Our Expertise in Subsystem & SoC Integration

1. Subsystem Development & Integration

We design and integrate reusable subsystems (CPU clusters, interconnects, memory controllers, I/O interfaces, etc.) ensuring scalability, configurability, and smooth hand-off into the SoC environment.

2. SoC Assembly & Top-Level Integration

From RTL assembly to hierarchical design management, our team ensures clean integration at the top level—resolving connectivity, power intent (UPF/CPF), and timing constraints efficiently.

3. Verification & Validation at SoC Level

Integration doesn’t stop at connectivity. We perform functional verification, low-power verification, and system-level simulations to validate subsystem interactions across real use cases.

4. Performance Optimization & PPA Closure

Avecas engineers focus on latency, throughput, timing closure, and power optimization, ensuring your SoC meets design specifications across process corners.

5. Customization for Your Market Needs

Whether it’s automotive, networking, IoT, or AI/ML accelerators, we tailor subsystem integration flows to align with your product vision and industry requirements.