Connected engineering
Consider architecture, implementation, verification, and system integration together, with clear interfaces between disciplines.
SEMICONDUCTOR & EMBEDDED ENGINEERING
IC design.Embedded engineering.
RTL, verification, physical design, DFT, custom IP, and embedded systems. Work with Avecas on a specialist design task or a coordinated turnkey programme.
THE AVECAS APPROACH
From a design brief to the work that follows.
A chip programme involves different disciplines, each with its own inputs and handoffs. Avecas brings IC design, EDA workflows, and embedded engineering together around your specification, tool environment, and delivery schedule.
Meet your engineering partnerWHAT WE BUILD
Silicon, systems
& engineering partnerships.
A connected set of capabilities, from the chip at the heart of your product to the software and systems around it.
01
Semiconductor solutions
Architecture, RTL, verification, physical design, and test engineering.
Explore solutions
02
Embedded solutions
Hardware, firmware, FPGA, and the software that connects your system.
Explore solutions
03
Software solutions
Applications, engineering automation, cloud, and data workflows.
Explore solutions
04
Engineering partnerships
Explore project engineering, technical collaboration, and specialist support.
Explore solutions01 / ENGINEERING CAPABILITIES
IC design & embedded
engineering services.
From the first architecture decision to the final integration detail, find the expertise your design needs.
01RTL & architecture
Architecture starts with the blocks and interfaces.
Processor die reference; illustrative silicon architecture.
Turn system requirements into clear microarchitecture, synthesizable RTL, and an integration plan.
Explore RTL & architecture02Design verification
Follow the signals. Verify the behaviour.
GTKWave reference waveform; illustrative verification view.
Build confidence with verification planning, simulation, coverage analysis, and formal methods.
Explore Design verification03Physical design
From logical connectivity to physical implementation.
Historical processor layout; illustrative physical design reference.
Connect implementation decisions to timing, power, area, and physical signoff requirements.
Explore Physical design04Design for test
Connect test intent to measurable silicon.
Microchip probing setup; illustrative test and measurement equipment.
Plan test architecture, scan integration, ATPG, and the handoff to production test.
Explore Design for test05Analog & mixed signal
Device geometry. Matching. Parasitic awareness.
Transistor-array micrograph; illustrative device-layout reference.
Support analog layout, integration, and verification across the agreed process and design rules.
Explore Analog & mixed signal06Embedded & FPGA
Bring logic, firmware and hardware together.
FPGA development board; illustrative prototyping platform.
Bring hardware and software together through prototyping, firmware, and system validation.
Explore Embedded & FPGA02 / TURNKEY IC DESIGN
One coordinated plan.
From specification
to engineering handoff.
Coordinate architecture, RTL, verification, DFT and physical implementation around one agreed delivery plan. Start with a complete programme or a defined work package, with named owners and clear acceptance criteria.
Align the disciplines.
Make each handoff usable.
THE APPROACH
Three decisions shape the work.
- 01
Define the scope
Agree requirements, owners and acceptance criteria.
- 02
Build and verify
Coordinate design, test and implementation around shared reviews.
- 03
Review and hand off
Deliver the agreed design package, evidence and open actions.
03 / IP, DEVELOPMENT & RESEARCH
Custom IP, development
& research.
Define a reusable block. Explore a new engineering approach. Turn a research question into evidence you can review.
DESIGNED FOR INTEGRATION
Custom silicon IP
Build around the functions and interfaces your system needs, from the block specification to verified integration collateral.
Specification · Implementation · Verification
Explore IP engineering
FROM IDEA TO WORKING PROTOTYPE
In-house development
Explore AVF design-flow automation and internal development work, with clear inputs, repeatable execution and reviewable results.
Prototype · Automate · Evaluate
Explore development
QUESTIONS INTO EVIDENCE
Research & innovation
Frame a technical question, test an approach and document the evidence. Plan disclosure and intellectual property around the work.
Investigate · Validate · Document
Explore researchWHY AVECAS
Technical depth.
A shared ambition.
The strongest engineering partnerships begin with a shared understanding of the problem. Here is how we approach the work.
More about Avecas ↗IP built around your needs
Define the functional scope, integration requirements, reuse rights, and delivery evidence for your custom IP engagement.
A focus on engineering methods
Discuss reusable design collateral, verification workflows, and automation opportunities within the agreed project scope.
Collaboration with clarity
Agree the technical milestones, responsibilities, review points, and acceptance criteria before execution begins.
05 / ENGINEERING IN PRACTICE
Good questions.
Clearer decisions.
Explore practical briefs and clearly labelled illustrative studies, with the inputs, workflows and review evidence behind each engineering decision.
Illustrative engineering study
Physical design · 5 min read
Reviewing a congested floorplan before timing closure
An illustrative physical-design study of macro placement, routing access and the evidence needed to compare alternatives.
Read the study: Reviewing a congested floorplan before timing closure
Illustrative engineering study
Firmware · 5 min read
Designing a firmware update that can recover from interruption
An illustrative embedded study of update state, image validation, power loss and recovery testing.
Read the study: Designing a firmware update that can recover from interruption
Engineering brief
Turnkey planning · 5 min read
What belongs in a turnkey IC-design project brief
A practical guide to defining scope, interfaces, responsibilities and acceptance before an IC-design programme begins.
Read the brief: What belongs in a turnkey IC-design project brief04 / ENGINEERING JOURNAL
Engineering journal.
Oct 24, 2026
How Does CMP Slurry Selectivity Control Material Removal?
As semiconductor devices become smaller and more complex, achieving a flat, uniform wafer surface is essential for reliable chip manufacturing. Multiple layers of dielectric…
Read article How Does CMP Slurry Selectivity Control Material Removal?
Oct 23, 2026
How Does Resist Footing Affect Semiconductor Pattern Transfer?
In semiconductor manufacturing, lithography defines the tiny patterns that eventually become transistor gates, contacts, vias, and interconnects. However, creating the intended pattern in photoresist…
Read article How Does Resist Footing Affect Semiconductor Pattern Transfer?YOUR NEXT CHAPTER STARTS HERE
What will you
build next?
Bring us your engineering challenge.
Let’s define the path from idea to implementation.