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- Silicon Engineering
- Packaging & Test
- Embedded Solutions
- Insights
- Company
At Avecas, our Assembly & Advanced Packaging services cover the full spectrum—from traditional wire bond through heterogeneous chiplet integration. We support consumer, automotive, HPC, and IoT devices from NPI through high-volume production.
End-to-End Package Support
From package selection and substrate design to final assembly and test, Avecas manages the full flow—reducing handoff risk between design and manufacturing.
Advanced Technology Readiness
We support 2.5D/3D-IC, FOWLP, and chiplet integration alongside established wire bond and flip-chip flows.
Automotive & High-Reliability Focus
AEC-Q100/Q101 compliant package qualification, JEDEC reliability testing, and PPAP documentation for automotive customers.
Feel free to email us on below email address, we will be happy to answer your queries.
AEC-Q100/Q101-capable qualification, JEDEC reliability testing, and full PPAP traceability for high-reliability programmes.
Our packaging capabilities span wire bond, flip-chip, fan-out, 2.5D/3D, and SiP—all under one roof. We coordinate with fab, substrate, and OSAT partners to deliver a seamless package solution.
Avecas operates as a turnkey OSAT partner, taking responsibility for the complete back-end flow so design teams can stay focused on silicon. From package selection and substrate design through die attach, interconnect, moulding, and singulation, every step is engineered to protect yield, reliability, and time-to-market.
Our portfolio spans the full assembly spectrum: fine-pitch wire bond for QFN, QFP, BGA, LGA, and CSP; copper-pillar and solder-bump flip-chip; Fan-Out Wafer-Level Packaging (FOWLP/eWLB) for thin, high-I/O devices; and advanced 2.5D/3D-IC builds with HBM stacks, silicon interposers, and silicon bridges. Chiplet-based System-in-Package and Package-on-Package integration support heterogeneous architectures for AI, HPC, and data-centre silicon.
Every programme is backed by AEC-Q100/Q101-capable qualification, JEDEC moisture-sensitivity and reliability testing, and full PPAP documentation with material declarations and lot traceability. Warpage, thermal, and mechanical-stress management are designed in from the start for large-body and multi-die packages, with SI/PI and thermal modelling at the co-design stage.
We plug in at any stage, from package feasibility studies to full NPI-to-HVM ownership, and coordinate a qualified fab, substrate, and OSAT partner network on your behalf.
The result is one team that carries your device from first build to volume production with consistent quality and predictable execution.
Assembly and packaging questions are common for teams evaluating outsourced OSAT or evaluating package options for a new device. Here are answers to the most frequent questions.