EXPLORE AVECAS
Perspectives on silicon design, verification, embedded systems, and the engineering decisions behind them.
Mar 14, 2026
In the world of cybersecurity, there is a looming deadline known as “Q-Day”, the moment a quantum computer becomes powerful enough to break the…
Read article Post-Quantum Cryptography (PQC) at the Hardware Level: Securing 2026 Chips Against Future Quantum ThreatsMar 13, 2026
For decades, the movement of data within a data center has relied almost exclusively on electrons traveling through copper wires. Whether it is a…
Read article Silicon Photonics: Overcoming the “Copper Wall” with Light-Based Data Transmission in Data CentersMar 12, 2026
In the early days of the semiconductor industry, a chip was a black box. Once it left the fabrication plant, its origins, the ethical…
Read article Supply Chain Traceability: Using Digital Product Passports (DPP) to Meet New Global Compliance StandardsMar 12, 2026
The FinFET has reached its practical limit. Gate-all-around transistors, marketed as RibbonFET and MBCFET, are the industry's answer for the 2nm generation and beyond.
Read article GAA Transistors: RibbonFET and MBCFET ExplainedMar 11, 2026
For decades, the semiconductor instruction set architecture (ISA) landscape was a rigid duopoly. If you were building a high-performance server or PC, you used…
Read article The RISC-V Surge: Why Open-Source ISA is Becoming a Mainstream Alternative for Custom AI SiliconMar 10, 2026
As the global demand for high-performance computing and AI hardware reaches unprecedented levels, the environmental footprint of the semiconductor industry has come under intense…
Read article Semiconductor Sustainability 2026: How Foundries are Reclaiming 90% of Process WaterMar 9, 2026
The Economic Reality of the Chiplet Era In the traditional monolithic approach to semiconductor design, a single defect on a wafer typically resulted in…
Read article Known Good Die (KGD) Strategies: Minimizing Scrappage in Complex Chiplet Assembly EcosystemsMar 9, 2026
Britain chose to specialise in compound semiconductors instead of chasing leading-edge silicon fabs, a niche strategy that trades scale for differentiated, high-value technology and…
Read article Why the UK Bet on Compound Semiconductors, Not Leading-Edge FabsMar 8, 2026
For decades, the semiconductor industry has relied on organic materials, specifically epoxy-based laminates, to serve as the foundation for chip packaging. These organic substrates…
Read article Glass Substrates vs. Organic: Why the Industry is Shifting Materials for High-Speed AI InterconnectsMar 7, 2026
The move toward 3D Integrated Circuits (3D-ICs) is driven by the need for shorter interconnects, higher bandwidth, and a smaller physical footprint. By stacking…
Read article Thermal Management in 3D-ICs: Advanced Cooling Solutions for Vertically Stacked High-Performance DiesMar 6, 2026
India's chip strategy prioritises ATMP and OSAT assembly and test over leading-edge fabs, a pragmatic entry route with lower capital risk and faster returns.
Read article ATMP/OSAT vs Front-End Fabs: India’s Pragmatic Entry StrategyMar 6, 2026
Introduction The semiconductor industry is entering a transformative phase with the transition to 2nm technology nodes. As traditional FinFET architectures approach their physical limits,…
Read article The 2nm Transition, Navigating the Challenges of GAAFET Architectures
