EXPLORE AVECAS
Perspectives on silicon design, verification, embedded systems, and the engineering decisions behind them.
Jun 10, 2026
Building a semiconductor supply chain from a low base is a decades-long undertaking; this piece explains the layers involved and why the sequencing matters.
Read article How India Is Building a Semiconductor Supply Chain from ScratchJun 9, 2026
The semiconductor industry has achieved remarkable advances in transistor scaling, enabling processors with billions of transistors and unprecedented computational power. However, as chips become…
Read article Silicon Photonics: The Future of Chip CommunicationJun 8, 2026
As semiconductor technology advances toward 2nm and beyond, traditional chip design approaches are reaching their physical limits. Engineers are facing growing challenges related to…
Read article Backside Power Delivery: A Game-Changer for Future ChipsJun 7, 2026
What Is Dark Silicon? For decades, semiconductor technology advanced by shrinking transistors and packing more of them onto a chip. More transistors usually meant…
Read article Dark Silicon in Modern Processors: The Hidden Challenge of Advanced Chip DesignJun 7, 2026
Analog and digital design are two distinct VLSI paths with different skills and mindsets. This guide compares them to help you choose the right…
Read article Analog vs Digital Design: Choosing Your VLSI PathJun 5, 2026
As semiconductor devices continue to evolve, the demand for higher performance, lower power consumption, and smaller form factors is growing rapidly. While transistor scaling…
Read article Fan-Out Wafer-Level Packaging (FOWLP): Powering Next-Generation ChipsJun 4, 2026
As AI clusters scale to tens of thousands of accelerators, electrical links strain to keep up. Silicon photonics and co-packaged optics offer a path…
Read article Silicon Photonics and Co-Packaged Optics for AI ClustersJun 4, 2026
The semiconductor industry is continuously pushing the boundaries of performance, power efficiency, and integration. As traditional transistor scaling becomes increasingly challenging, advanced packaging technologies…
Read article 2.5D vs 3D IC Packaging: Key Differences and ApplicationsJun 3, 2026
For decades, Dynamic Random Access Memory (DRAM) has been the workhorse of modern computing. From smartphones and laptops to AI accelerators and hyperscale data…
Read article Beyond DRAM: The Emerging Memory Technologies Reshaping ComputingMay 31, 2026
Europe's carmakers depend heavily on semiconductors, and recent shortages exposed that vulnerability, prompting a push for greater sovereignty over the chips that keep the…
Read article Europe’s Automotive Chip Dependence and the Push for SovereigntyMay 28, 2026
Micron's memory megafabs in New York and Idaho aim to anchor advanced DRAM production in the United States, strengthening a strategically vital supply chain.
Read article Micron’s US Memory Megafabs: New York and IdahoMay 25, 2026
Beyond conventional silicon, India is pursuing compound semiconductors such as silicon carbide and gallium nitride, materials central to power electronics and high-frequency applications.
Read article India’s Compound Semiconductor Push: SiC and GaN
