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- Silicon Engineering
- Packaging & Test
- Embedded Solutions
- Insights
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At Avecas, our System-Level Test (SLT) services exercise devices in their actual operating environment—running real application workloads under real supply, thermal, and clock conditions to catch defects that conventional ATE misses.
Custom SLT Platform Development
We design bespoke SLT boards per device—handling PCIe, DDR, USB, SerDes, and power delivery for the application environment.
AI, Networking & Automotive Coverage
From TOPS measurement for AI accelerators to packet throughput for networking SoCs and AEC-Q100 thermal range for automotive.
SLT-ATE Correlation & Analytics
We correlate SLT escape data with upstream ATE structural tests to close coverage gaps and reduce SLT cost.
Feel free to email us on below email address, we will be happy to answer your queries.
We correlate SLT escapes with ATE structural data to close coverage gaps and optimise total test cost.
Our SLT capabilities span custom board development, firmware boot, performance measurement, thermal margining, and analytics—for AI, networking, and automotive silicon.
System-Level Test (SLT) exercises a packaged device exactly as the end application will, booting real firmware and running real workloads under real supply, thermal, and clock conditions. It catches marginal and system-level defects, including timing-, power-, and temperature-dependent escapes, that structural ATE patterns cannot reach, reducing costly customer returns.
We design bespoke SLT boards for each device, integrating power delivery, high-speed SerDes, PCIe and USB host interfaces, and DDR memory subsystems tuned to the target environment. Test content runs the full boot sequence, memory self-test, peripheral enumeration, and application-level functional flows representative of real deployment, with logging for post-test triage.
For AI accelerators we validate TOPS throughput and thermal sustainability; for networking SoCs, line-rate packet throughput; and for automotive devices, operation across the full AEC-Q100 thermal range. Concurrent per-rail power measurement and voltage/temperature margining (shmoo) expose marginal behaviour before it reaches the field.
We correlate SLT escapes with upstream ATE structural and functional data to place each test at its most cost-effective insertion, closing coverage gaps without paying for redundant testing across the product lifecycle.
The result is higher outgoing quality and fewer field returns at a controlled, optimised test cost.
Across engagements we also support thermal-chamber and active-thermal-control integration, automated result logging for full traceability, and SLT-coverage reporting that quantifies exactly which defect classes SLT adds over ATE, so every test second is justified.
SLT questions arise when ATE coverage gaps are suspected or when automotive/AI chips require mission-mode validation. Here are answers to the most common questions.