0
++
- Silicon Engineering
- Packaging & Test
- Embedded Solutions
- Insights
- Company
At Avecas, our Burn-In & Reliability Qualification services screen early-life failures and validate device lifetime under accelerated stress—covering JEDEC, AEC-Q100, and AEC-Q101 for automotive and high-reliability silicon.
Full JEDEC Qualification Matrix
HTOL, PCT, HAST, thermal cycling, ESD (HBM/CDM/MM), and latch-up under a single programme.
Automotive Grade Expertise
AEC-Q100 and AEC-Q101 flows with PPAP documentation, material declarations, and customer-specific qualification plans.
Structured Failure Analysis Integration
Reliability fallout channelled into FA to classify failure mode, identify root cause, and feed back to design and process teams.
Feel free to email us on below email address, we will be happy to answer your queries.
Reliability fallout flows straight into failure analysis to classify the failure mode and drive corrective action.
Our reliability capabilities span HTOL, ESD, HAST, thermal cycle, and latch-up—supporting JEDEC, AEC-Q100/Q101, and customer-specific plans for consumer through automotive silicon.
Reliability qualification proves that silicon will survive its target mission profile over its rated life. Avecas applies accelerated stress to screen early-life failures and validate long-term durability against JEDEC, AEC-Q100, and AEC-Q101 requirements, with acceleration models that translate stress hours into field-equivalent lifetime.
We run HTOL lifetime stress at elevated voltage and junction temperature, ESD qualification (HBM, CDM, MM) and latch-up per JEDEC, Pressure Cooker Test (PCT) and HAST for moisture resistance, biased-HAST, high-temperature storage life (HTSL), and thermal cycle (-55 °C to +150 °C), thermal shock, and mechanical shock and vibration per JEDEC JESD22. Read-point schedules follow standard 168/500/1000-hour programmes with extended durations and custom profiles on request.
For automotive and industrial customers we execute full AEC-Q100 and AEC-Q101 matrices with PPAP documentation, material declarations, moisture-sensitivity-level (MSL) classification, and customer-specific mission profiles, giving you a defensible qualification package for your end customers.
Every reliability fallout is routed into structured failure analysis to classify the failure mode, localise the defect, and identify root cause, then fed back to design and process teams so each revision is measurably more robust than the last.
The outcome is documented, audit-ready evidence that your device meets its reliability targets.
Reliability qualification questions arise early in product development and during supplier audits. Here are answers to the most common questions about burn-in and reliability testing.