Failure analysis converts yield loss and reliability failures into actionable root cause. Avecas follows a structured progression from non-destructive screening to targeted physical analysis, preserving evidence at each step and maximising the information recovered from every precious sample.

Non-Destructive First

We begin with C-SAM acoustic microscopy for delamination and voids, 2D/3D X-ray tomography for wire-sweep, voids, and internal package defects, and high-resolution optical inspection, so sample integrity is preserved before any destructive step. This sequencing protects the failure site and improves the accuracy of downstream diagnosis.

Physical & Electrical Analysis

For physical analysis we use SEM for nanometre-resolution defect imaging and EDX for elemental composition of contaminants and residues, plus FIB for precision cross-sectioning of metal stacks and via chains and FIB circuit edit for LVS-discrepancy verification. Emission Microscopy (EMMI), OBIRCH, and IR/liquid-crystal thermal imaging localise leakage paths, gate-oxide breakdown, and metal shorts.

Reporting & Corrective Action

Each investigation closes with a structured report: confirmed failure mode, root cause, supporting imagery and analysis, and recommended corrective actions for design, process, or assembly teams to prevent recurrence.

• Acoustic (C-SAM), X-ray tomography, and optical screening
• SEM/EDX defect imaging and elemental characterisation
• FIB cross-section and circuit edit for LVS verification
• EMMI, OBIRCH, and thermal fault localisation

The outcome is a clear, evidence-backed path from symptom to verified root cause.

We also offer construction analysis, chemical and laser decapsulation, parallel lapping, and de-processing to expose successive metal and device layers, supporting both single-unit triage and lot-level systematic investigations.