At Avecas, our ATE Programming & Development services bridge design intent and manufacturable silicon—delivering ATE solutions on Teradyne UltraFLEX, J750, Advantest V93000, and Cohu/Xcerra platforms from loadboard design through production handover.
Multi-Platform Expertise
Deep experience on Teradyne (IG-XL), Advantest (SmarTest 8), and Cohu covers digital, mixed-signal, RF/mmWave, and high-speed serial test.
Loadboard & DIB Engineering
We design and qualify DIBs and probe cards—handling SI/PI analysis, power delivery, thermal management, and socket qualification per NPI.
Test Flow Optimisation
Adaptive test, smart-bin wafer maps, SPC integration, and multi-site parallelism to reduce test time and cost at HVM scale.
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Adaptive test, smart-bin maps, SPC, and site-to-site correlation deliver a stable, qualified test program.
Our ATE capabilities cover Teradyne, Advantest, and Cohu—including test program development, loadboard/DIB design, test cell bring-up, site-to-site correlation, and production handover.
Test program development on Teradyne UltraFLEX (IG-XL) and J750 covering DC, functional pattern porting, mixed-signal, and RF with multi-site correlation.
SmarTest 8 development for V93000 Wave Scale and Pin Scale covering SoC, memory, RF/mmWave, and high-speed digital test including DDR and PCIe.
Device Interface Board schematic and PCB layout for probe cards and test sockets with SI/PI, power delivery, and socket qualification.
Test flow sequencing, bin definitions, adaptive test, smart-bin wafer map integration, and SPC for production health monitoring.





ATE program development turns a device specification into a production-ready test solution. Avecas delivers the test program, the interface hardware, and the test-flow logic needed to test economically and reliably at high volume, with correlation evidence that the program measures what the datasheet demands.
We develop on Teradyne UltraFLEX (IG-XL) and J750, and Advantest V93000 (SmarTest 8, Wave Scale and Pin Scale), covering SoC, memory, RF/mmWave, and mixed-signal devices. Content spans DC parametric, scan and functional patterns, mixed-signal, and RF measurement, with timing and level set-up correlated back to bench and characterisation data.
We design and qualify Device Interface Boards and probe cards, handling schematic capture, PCB stack-up and layout, SI/PI analysis, power delivery and decoupling, thermal management, and socket qualification per NPI. Test flows use adaptive test, smart-bin wafer maps, SPC, and multi-site parallelism to cut tester time while protecting quality.
We bring up the test cell, run site-to-site correlation and gage R&R, debug first-silicon test escapes, document the program, and hand over a stable, production-qualified solution to your manufacturing or OSAT partner.
The result is a fully characterised program ready to run at scale from day one.
We also maintain program version control, characterisation-to-production correlation records, and clear release notes, so the test program stays maintainable across device steppings, ATE relocations, and capacity expansions.
ATE programming questions arise during NPI planning and test cost reduction reviews. Here are answers to the most frequent questions about ATE platform engineering.
We develop production-ready test programs that translate device specifications into executable ATE flows — covering DC, functional patterns, mixed-signal, and RF — plus the hardware (loadboards, DIBs, sockets) and the test-flow logic needed to test economically at volume.
We develop on Teradyne UltraFLEX (IG-XL) and J750, and Advantest V93000 (SmarTest 8, Wave Scale and Pin Scale), covering SoC, memory, RF/mmWave, and mixed-signal devices.
Yes. We design and qualify Device Interface Boards and probe cards including schematic, PCB layout, SI/PI analysis, power delivery, thermal management, and socket qualification for each new product.
We apply test-flow sequencing, optimised bin definitions, adaptive test, smart-bin wafer-map integration, SPC, and multi-site parallelism to cut test time and cost while protecting quality at high-volume scale.
Yes. We bring up the test cell, perform site-to-site correlation and gage R&R, document the program, and hand over a stable, production-qualified solution to your manufacturing or OSAT partner.