Understanding Power, Performance and Area (PPA) Trade-offs
Power, performance and area form the central trade-off in every chip design. This guide explains PPA and the choices engineers make to balance the three.
High-NA EUV: ASML’s Next Lithography Leap
Lithography has always paced the semiconductor roadmap. High-NA EUV, with its larger numerical aperture, is ASML’s next lever for printing the smallest features.
The EU Chips Act: Europe’s Bid for a Bigger Share
The EU Chips Act is Europe’s coordinated effort to expand its share of global semiconductor production, combining public funding, research support and supply-chain resilience measures.
TSMC Arizona: Bringing Advanced Nodes to US Soil
TSMC’s Arizona fabs bring advanced-node production to US soil, testing whether leading-edge manufacturing can thrive outside its established Taiwanese base.
India’s VLSI Talent Gap: Scaling the Engineering Workforce
India has a large engineering base but faces a gap in specialised, fab-ready semiconductor skills; this piece examines the talent challenge and how it is being addressed.
Design Verification: UVM and the Rise of Formal Methods
Design verification proves a chip works before it is built. This guide introduces UVM-based simulation and the growing role of formal methods in modern verification.
Backside Power Delivery: PowerVia and Beyond
Delivering power to transistors from the back of the wafer sounds like a detail, yet backside power delivery is one of the most significant structural changes in modern chips.
ARM: The UK’s Crown Jewel in Global Chip Design
ARM sits at the heart of the UK’s semiconductor identity, licensing processor architectures that power billions of devices worldwide and demonstrating the outsized value of intellectual property.
The US CHIPS Act: Domestic Fab Buildout Explained
The US CHIPS Act channels federal incentives towards domestic fabrication, aiming to rebuild American semiconductor manufacturing and reduce reliance on overseas supply.
Why Global OSAT Players Are Betting on India
An analysis of why leading global outsourced semiconductor assembly and test providers are increasingly considering India as a location for new capacity.