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Assembly & Packaging

Precise & Scalable

From Startup to Industry Leader

Wire Bond, Flip-Chip, FOWLP & SiP for Automotive, HPC & Consumer Silicon

          At Avecas, our Assembly & Advanced Packaging services cover the full spectrum—from traditional wire bond through heterogeneous chiplet integration. We support consumer, automotive, HPC, and IoT devices from NPI through high-volume production.

What Sets Us Apart

  • End-to-End Package Support
    From package selection and substrate design to final assembly and test, Avecas manages the full flow—reducing handoff risk between design and manufacturing.

  • Advanced Technology Readiness
    We support 2.5D/3D-IC, FOWLP, and chiplet integration alongside established wire bond and flip-chip flows.

  • Automotive & High-Reliability Focus
    AEC-Q100/Q101 compliant package qualification, JEDEC reliability testing, and PPAP documentation for automotive customers.

Our Services

Back-end Design

Synthesis
Physical Design
Physical Verification
STA
PDN
ECO & Signeoff

Front-End Design

RTL Design
Design & Verification (DV)
Logical Synthesis
Design for Testability (DFT )
FPGA & Prototyping
Formal Verification
Low Power
Analog Layout Design
AMS Verification
Analog Circuit Design
DFT Architecture & Planning
Scan Insertion & Scan Compression
ATPG & Fault Coverage Optimization
Memory BIST & Logic BIST
Boundary Scan & JTAG
DFT for Low Power Designs
DFT Verification & Validation
Production Test & Silicon Bring-Up Support
EDA Flow Automation & Scripting
Library & PDK Development
Design Enhancement & Methodology Services
EDA Tool Integration & Support
Technology File & Model Development
CAD Infrastructure Management
Custom IP Development
Subsystem & SoC Integration
Low-Power SoC Design for IoT & Automotive
Safety & Security Compliant Designs
Process Engineers
Device Engineers
Yield & Reliability Engineer
TCAD Modelling Engineer
Packing & Advanced Technology Engineer
CAD Methodology Engineer
EDA Tool Support Engineer
Library / PDK Engineer
PDK Development & Validation
Embedded Hardware
PCB Design
Signal Integrity
Hardware Validation
Power & Thermal Design
Embedded Software
Firmware
Device Driver
RTOS
Middleware
Embedded Test
System Validation
Test Automation
Compliance & Certification
Hardware-Software Co-Verification
FPGA Architecture & Design
FPGA Prototyping & Implementation
DSP Algorithm Development & Optimization
FPGA-Based DSP Implementation
Embedded FPGA & SoC Solutions
Automotive Embedded
ECU Software
AUTOSAR
ADAS
EV Battery Management
Functional Safety
Embedded AI
Edge AI
Vision Processing
DSP/AI Acceleration
Embedded ML
Enterprise Applications (ERP, CRM, HRM)
SaaS & Cloud-Native Applications
Legacy Application Modernization
API Development & Integration
Cross-Platform Application Development
Full-Stack Web Development (React, Angular, Node.js, Django)
Progressive Web Apps (PWAs)
Native & Hybrid Mobile Apps (Android – Kotlin, iOS – Swift, Flutter, React Native)
UI/UX Design & Frontend Engineering
E-Commerce & CMS Solutions
Secure Software Development Lifecycle (SSDLC)
Application Security Testing (SAST, DAST)
Penetration Testing & Vulnerability Assessment
QA & Test Automation (Selenium, Cypress, JUnit)
Performance & Scalability Testing
Cloud-Native ERP & CRM Solutions
Low-Code/No-Code Application Development
RPA (Robotic Process Automation)
Blockchain Development & Smart Contracts
AR/VR & Metaverse Applications
Cloud Migration & Deployment (AWS, Azure, Google Cloud)
DevOps Automation (CI/CD, GitOps, Jenkins, Terraform)
Containerization (Docker, Kubernetes)
Cloud Security & Compliance
Microservices Architecture
AI & Machine Learning Solutions (TensorFlow, PyTorch, Scikit-learn)
Data Engineering & Warehousing
Business Intelligence & Analytics (Power BI, Tableau)
Natural Language Processing (NLP)
Predictive & Prescriptive Analytics
Firmware & Device Driver Development
Embedded Linux & RTOS Solutions
Board Support Packages (BSP)
IoT Device Software Development
Integration with VLSI & Semiconductor Systems
Proof of Concept (PoC) Development
Prototype to Production Transition
Cost & Performance Optimization
Product Lifecycle Management (PLM)
Sustenance & Maintenance Engineering
VLSI Design & Verification Training
Embedded Systems & IoT Training
Software Development & AI/ML Training
Corporate Training Programs
Internship & University Partnerships
Onsite & Offshore Engineering Resources
VLSI, Embedded, and Software Consultants
Flexible Engagement Models (Hourly, Monthly, Project-Based)
Dedicated Offshore Development Centers (ODC)
Functional & Regression Testing
Hardware-in-the-Loop (HIL) Testing
Automated Test Development
Compliance & Certification Support (ISO, IEC, Automotive, Telecom)
Reliability & Stress Testing
Semiconductor & VLSI Consulting
Embedded Product Roadmap Planning
Digital Transformation & Cloud Advisory
Cost Optimization & Design Migration
IP Licensing & Technology Partnerships

Your Partner for Advanced Semiconductor Packaging

Have Any Question

Feel free to email us on below email address, we will be happy to answer your queries.

for You

Why It

Matters

Speed to Market

From package selection and substrate design to final assembly and test, we manage the full flow under one roof — reducing handoff risk between design and manufacturing.

Lower Risk

2.5D/3D-IC, FOWLP, and chiplet integration alongside proven wire bond and flip-chip flows keep your product roadmap future-proof.

Energy Efficiency

AEC-Q100/Q101-capable qualification, JEDEC reliability testing, and full PPAP traceability for high-reliability programmes.

Crafted for Real-World Success

Our packaging capabilities span wire bond, flip-chip, fan-out, 2.5D/3D, and SiP—all under one roof. We coordinate with fab, substrate, and OSAT partners to deliver a seamless package solution.

Wire Bond & Flip-Chip

Turnkey wire bond assembly for QFP, BGA, LGA, and CSP packages with fine-pitch capability, multi-tier stacked-die, and MCM configurations.

FOWLP & Fan-Out

Fan-Out Wafer-Level Packaging (FOWLP/eWLB) for thin, compact, high-I/O devices including mobile SoCs, RF modules, and wearables.

2.5D / 3D-IC & Chiplet

HBM interposer, silicon bridge, and chiplet-based SiP assembly for AI, HPC, and data-centre chips requiring 2.5D/3D integration.

SiP & Package-on-Package

Multi-die SiP and Package-on-Package (PoP) integration with passive embedding, substrate stack-up coordination, and qualification.

Continuous Innovation

Dedicated Support

Positive Client Experiences

Commitment to Excellence

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Package Types Supported

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Advanced Integration Platforms

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AEC-Q100 / Q101 Capable Flows

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Reliability Grade Tiers

Trusted Across Automotive, HPC, AI & Consumer Silicon Programmes

FAQ

Everything You Need to Know
About Avecas Assembly & Packaging Services

Assembly and packaging questions are common for teams evaluating outsourced OSAT or evaluating package options for a new device. Here are answers to the most frequent questions.

Avecas provides end-to-end OSAT services covering wire bond (QFP, BGA, LGA, CSP), flip-chip, Fan-Out Wafer-Level Packaging (FOWLP/eWLB), 2.5D/3D-IC with HBM interposers and silicon bridges, chiplet integration, System-in-Package (SiP), and Package-on-Package (PoP). We coordinate substrate design, die attach, interconnect, moulding, and singulation through to final test.