Delivering Analog-Mixed Signal () circuits is one of the most challenging steps in modern semiconductor design. Unlike purely digital circuits, chip designs must deliver high accuracy, low noise, and reliable performance under varying conditions. A single verification gap can lead to costly re-spins and delayed tape-out.

          At Avecas, we offer end-to-end Turnkey Chip Projects — Concept to Silicon to ensure your designs meet performance, reliability, and manufacturability requirements before hitting silicon. Our engineering methodology blends industry-leading tools, proven techniques, and domain expertise to help you achieve first-time-right silicon with confidence.

Avecas Turnkey Chip Projects — Concept to Silicon

We provide comprehensive semiconductor design services covering the entire design cycle:

1. Block-Level Verification

• Requirements capture and architecture specification

• IP selection and licensing negotiations

• RTL design and verification

2. Mixed-Signal SoC Verification

• Physical design at 5nm to 180nm nodes

• DFT insertion and ATPG closureSERDES, I/O, and clock networks.

• Sign-off flow (LVS, DRC, ERC, EM/IR, timing, power)

3. Parasitic-Aware Verification

• Foundry management (mask, shuttle, MPW, HVM)RC extraction and LDE effects.

• Analysis of signal integrity, crosstalk, and jitter.

• Package co-design and DFM optimization

4. Corner & Monte Carlo Analysis

• Validation across PVT corners (process, voltage, temperature).

• Test program development (Advantest, Teradyne)

• Ensuring robust performance under variability.

5. Modeling & Abstraction

• Creation of Verilog-A/MS behavioral models.

• Post-silicon bring-up and characterization

• Failure analysis and yield ramp support

6. Signoff & Tape-Out Verification

• Product qualification (AEC-Q100, JEDEC, ISO 26262)

• Full sign-off flow with tapeout package documentation.

• Final tapeout package delivery with foundry-specific compliance.